Amphenol ICC's Commercial IO meets the requirements for Input/Output connectors for all applications in the Commercial, Industrial, Communications, Server, Storage, Medical, Consumer, Automotive, Military and Aerospace markets.
Amphenol ICC is recognized as a leading supplier of connectors in the Storage industry, with best-in-class signal integrity performance for 12G & 24G SAS and SAS/ PCIe (U.2) products.
Amphenol ICC's basics solutions include Signal & Mid Power Wire-to-Board, Board-to-Board, Input/Output, FFC/FPC and Backplane. We offer interconnection systems from 2.54mm pitch down to 0.40mm pitch, supporting speeds up to 25Gb/s.
The Amphenol ICC cStack high speed solderless interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.
Amphenol ICC's NeXLev is an established and proven high-density parallel board connector solution to meet current bandwidth demands in many mezzanine applications.
Amphenol ICC's NeXLev is an established and proven high-density parallel board connector solution to meet current bandwidth demands in many mezzanine applications.
Hemeixin PCB, a specialist in contract PCB manufacturing, offers Turn key PCB Assembly and Quick Turn PCB Assembly with lead times for prototype PCBs from 24/48 hours or 5/10 days, and for low-production orders of either 10, 15 or 20 days.
Designed for fast time-to-market and greater simplicity, Chameleon from Amphenol ICC has evolved into a highly adaptable connector solution. It sets a new standard for low profile BGA products with industry-leading flexibility, performance, and density in board-to-board applications.
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